Netanya, November 3, 2008 - Infra-Com Ltd., a world leader in short range diffused infrared (DIR™) wireless communication ICs and STMicroelectronics (NYSE: STM), a world leader in digital audio ICs, have demonstrated complete reference designs intended for consumer electronic products such as home theater systems, surround-sound and gaming speakers, DTV speakers, as well as portable music and aftermarket accessories in a special seminar held during the October Electronics Fair in Hong Kong. The mutual designs combine Infra-Com’s receiver side IrGate™ IC with the all-digital class D power amplifiers and signal processors from ST (STA326, STA333ML and STA335BW), creating a complete high-quality remote audio amplification system.

During the seminar several product/demo systems were on live display while Infra-Com and ST personnel gave detailed marketing, product and technical presentations about the suggested applications, their respective implementation and related technical details for the audio engineering community. Several private  meetings were also held during the seminar day with industry leaders in various disciplines like PC/Notebook manufacturers, audio IC manufacturers as well as large volume Chinese audio OEMs.

DIR enables optical communication without the need for line-of-sight between the transmitting and receiving nodes. Unlike a direct infrared signal - which emits light in a narrow beam - a diffused infrared device floods the room with the infrared emissions and utilizes natural reflections from the ceiling, walls, floor and other surfaces to maintain robust high bit rate communications, unaffected by obstructions or by moving people within the enclosure. The link effectively behaves similarly to a radio signal within its operating space, but with no possibility of being affected by, or generating, radio frequency interference (RFI); it is also insensitive to remote control signals, and cannot be ‘overheard’ in an adjacent room. Additionally DIR is a world wide unregulated technology operating at 870nm.

Audio signals using Infra-Com’s IrGate wireless infrared protocol are processed by an Rx Modem and interface IC, which receives data from the infrared sensors in the optical/analog front-end via an LVDS (Low Voltage Differential Signaling) interface and drives the ST’s full digital amplifier through an I2S (Inter-IC Sound) serial digital audio interface.

The M2C_IrGT801ADR_STA326 ref design uses the STA326 IC, which is a fully digital amplifier able to deliver 2x60W of audio power into 8ohm loudspeakers. It provides true hi-fi audio quality, with an uncompressed 24-bit 48kHz PCM (Pulse Code Modulation) wireless link, and almost zero latency for perfect lip-sync. Latency is just 150 microseconds compared to typically more than 7ms for competitive RF-based solutions. Amplifier efficiency is up to 92% - among the highest in the market. The amplifier enjoys full built-in over-current and over-temperature protection capabilities, and the all-digital audio stream maintains full audio quality and 100dB signal to noise ratio (SNR) and dynamic range.

The M2C_IrGT801ADR_STA333ML ref design uses the STA333ML IC, a fully digital micro-less IC amplifier able to deliver 2x20W without the need for an external heatsink. The STA333ML retains the highest digital audio quality without adding software development efforts.

The M2C_IrGT821ADR_STA335 ref design uses the STA335BW IC, a fully digital IC amplifier able to deliver 2x15W + 1x30W for 2.1 speaker amplification configurations without the need for an external heatsink. The design uses Infra-Com's latest chipset member family, the IrGT821A, which is additionally capable of delivering wireless I2C control capabilities enabling to remotely control the ST AMP as well as other speaker side peripherals from a transmitter unit's local microcontroller device.

The ST single-chip audio ICs integrate digital audio processing, digital amplifier control and DDX® digital power output stages. They can be configured easily via digital control to operate in one of several different output modes, and offer a full range of processing and equalization options.
The devices are taken from a range of single-chip single-package audio products in ST’s amplification family; other amplifiers in the family can be used upon request to satisfy different audio power requirements, from 2x1W up to 2x80W.

The M2C_IrGT8x1ADR_STAxxx reference designs are a set of complete, easy and ready to use turnkey designs for manufacturers of wireless audio products, combining high quality amplification with the plug and play and high quality traits of diffused infrared IrGate technology.

The above reference designs are fully available now for evaluation and product development.

Infra-Com Ltd. focuses on the development and commercialization of innovative, low-cost semiconductor chipsets for indoor, short-range wireless applications.
Further information on Infra-Com can be found at www.infra-com.com.

STMicroelectronics is a global leader in developing and delivering semiconductor solutions across the spectrum of microelectronics applications. An unrivalled combination of silicon and system expertise, manufacturing strength, Intellectual Property (IP) portfolio and strategic partners positions the Company at the forefront of System-on-Chip (SoC) technology and its products play a key role in enabling today's convergence markets. The Company's shares are traded on the New York Stock Exchange, on Euronext Paris and on the Milan Stock Exchange. Further information on ST can be found at www.st.com.